09/30/09 Globalfoundries on Track for 50% Natural Yield by Year End with 32nm Process Technology
"Globalfoundries expects to start volume production of 32nm-SHP (Super High Performance) technology at Fab 1 in the second half of 2010. This technology will employ silicon-on-insulator (SOI) substrates and utilize Globalfoundries’ innovative “Gate First” approach to high-K metal gate (HKMG), which maximizes power efficiency and transistor scaling while minimizing die size and design complexity when compared to the alternative “Gate Last” approach."
09/26/09 Globalfoundries Reschedulles 32nm SOI Production - Xbitlabs
"Globalfoundries, a joint-venture between Advanced Micro Devices and Advanced Technology Investment Company, said this week that it would initiate “risk production” of chips on 32nm silicon-on-insulator (SOI) process technology in the third quarter of 2010, not the first quarter of next year, as planned initially. But while Globalfoundries claims that its schedules are aligned with plans of its clients; AMD, who is the only customer for 32nm SOI at Globalfoundries, states that it would not delay its code-named Orochi processor that is based on Bulldozer micro-architecture."
09/23/09 Intel shows first 32nm chip - The Inquirer
"As a follow up to Westmere the next generation chip, codenamed Sandy Bridge, will see an acceleration in graphics capabilities for the chip, with Intel's sixth generation graphics core built into the die. This will accelerate floating point, video and processor intensive software applications."
08/01/09 Chartered to start 32nm pilot runs in 4Q09, sources say - Digitimes
"Chartered Semiconductor Manufacturing is scheduled to launch its 32nm process technology in the fourth quarter of 2009, and move to 28nm in the first half of 2010, industry sources have revealed. The Singapore-based foundry is expected to update its process advancement at an upcoming technology forum in Taiwan."
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