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02/25/05 Strained Si Enters Practical Use with Both nMOS, pMOS - NE Asia
"One feature of DSL is that it is a relatively simple means of improving performance for both pMOS and nMOS transistors. Strained Si technology requires that pMOS and nMOS channels are strained in different directions to improve the performance of both, and the resulting process complexity led most companies to only use the technology on one of the two types. IBM, for example, which has used strained Si technology since 90nm, only applied it on the nMOS side."
12/07/04 AMD ships 90nm Opterons - The Register
"The news comes a day after AMD announced it intends to incorporate its PowerNow! power preservation system into upcoming Opteron. Those chips are due to ship during H1 2005, the company said, so it's clear they represent a second generation of 90nm Opteron rather than the ones being made available today"
12/01/04 AMD’s 90nm process, a success story? - Hardware Analysis
"Simply that AMD is having its own set of problems with 90nm, it is hitting a clockspeed wall, much like Intel has, which prevents them from introducing faster processors. Unlike Intel, that basically launched their Prescott core Pentium 4 processors regardless of their power consumption and heat production, AMD only released processors that run at a, relatively speaking, low clockspeed, so heat production is manageable"
10/04/04 Athlon 64 90nm Thermals Part II: Not as Rosy as We Thought - Sudhian
"At the moment we’d say that 90nm Athlon 64 is running hotter than 130nm, even though this reverses our Friday position. We’re not taking a firm stance yet; there’s more data to be gone through. Either way, the CPU is still a good deal--and for the first time, an affordable price"
10/01/04 A Quick Look at AMD's 90nm Thermals: Has Sunnyvale Dodged the Prescott Bullet? - Sudhian
"Just as Prescott gave Intel the capability to build far more CPU’s per wafer, Winchester gives AMD much higher yield capacity—and because of AMD’s fab restrictions, its probably even more vital. The voltage drop is less than we might’ve expected—only a nominal 7%--but we’ll see how this translates in terms of temperature."
10/01/04 AMD Ships 90 nm, Reveals Operational Gains - Semiconductor International
"Today, AMD is shipping 90 nm Athlon 64 microprocessors for notebooks, and is on track to deliver 90 nm dual-core products to add performance while limiting power consumption mid-next year. With the introduction of copper at the 180 nm node; low-k dielectrics, SOI and first-generation strained silicon at 130 nm; and soon second-generation strained silicon at 90 nm, Sonderman attributes much of the company's success to its ability to manage technology transitions in a complex manufacturing environment"
09/10/04 AMD Ships Athlon 64 3700+ For Notebooks - Extreme Tech
"Desktop-replacement notebooks containing AMD's mobile Athlon 64 processor 3700+ will be included in the HP Pavilion zv5000z and Compaq Presario R3000Z notebooks, as well as VoodooPC's line of ENVY notebooks. The chip, priced at an even $500, is immediately available, AMD said"
08/17/04 AMD Ships 90 Nanometer AMD64 Products For Revenue
AMD announced today that it is achieving a smooth transition to 90 nanometer (nm) manufacturing and has shipped low-power 90nm Mobile AMD Athlon 64 processors for thin and light notebooks (previously codenamed "Oakville") for revenue. Manufacturers are expected to launch systems based on the new 90nm Mobile AMD Athlon 64 processors in the coming months
08/12/04 AMD sells first 90nm CPUs - analyst - The Register
"Root also claims that "AMD is one of the few companies on 90nm that does not seem to have had significant delays or defect issue". That remains to be seen. Certainly the chipmaker has allowed itself more time to explore the current leakage problems that plagued Intel's early 90nm offerings, while IBM continues to struggle with the 90nm yield issues that are causing Apple so much grief"
06/25/04 3GHz PowerPC G5 Eludes IBM - eWeek
"We're ahead of our competition, although I don't want to disparage anybody," Stein added. "The frequency jumps we've been able to achieve with the [PowerPC] 970FX have been greater than some of our competitors from 130 nm to 90 nm. We're getting a larger frequency jump, and we're facing the challenges better than most."
06/02/04 ATI to switch to 90 nanometres in 2005 - the inquirer
"ATI is already considering the next generation process at 90 nanometres in calendar 2005 which means that it is aggressively pushing its roadmaps ever onwards and upwards"
05/11/04 AMD sneaks out 90nm core in 130nm chip - The Register
"The new part contain 512KB of L2 cache and are available in Socket 754 lidless packaging. Both have a power consumption rating of 35W - 44 per cent lower power than previous Mobile AMD Athlon 64 processors, AMD said. They also use a smaller, lidless packaging. The new Athlon 64s operate at 1.2V - previous models run at 1.4V."
04/19/04 AMD starts 90-nm Opteron manufacturing in Germany - EE Times
Although details about the first product to migrate to the 90-nm process were not disclosed, a presentation by Sonderman given the day before the Semicon Europa exhibition here referred to the AMD64 family of Opteron and Athlon chips and the AMD 64-bit Opteron processor in particular. "There are no plans to migrate the classic Athlon to 90 nm," Sonderman confirmed."
03/03/04 AMD to start 90nm production next month... - The Register
"Certainly, AMD's two 90nm Athlon 64 parts, codenamed 'Winchester' (Athlon 64) and 'San Diego' (Athlon 64-FX) are roadmapped to appear during the second half of the year, as are the 90nm Opterons: 'Athens' (800 series), 'Troy' (200 series) and 'Venus' (100 series)."
02/27/04 TSMC gets chip deal with Nvidia - Taipei Times
"But analysts hinted that an unsuccessful trial run of more advanced 90-nanometer (nm) chips at International Business Machines Corp's IBM Microelectronics may be behind Nvidia's decision to make 0.11-micron chips at TSMC instead. A micron is a millionth of a meter and a nanometer is a billionth of a meter."
02/21/04 Intel Details 90nm Flash Memory Products - X-bit labs
"Intel’s Wireless Flash Memory manufactured on 90nm fabrication technology has about 50% smaller die size compared to the previous generation, which will lower costs and double Intel manufacturing capability. The new flash devices combine four innovations from Intel: low 1.8V operation, direct code execution (execute-in-place), enhanced factory programming and dual code and data storage in one chip."
02/13/04 IBM fabs 90nm G5 using strained silicon - The Register
"Now, where IBM differs from Intel is in the use of silicon-on-insulator (SOI), which conveniently aids the implementation of strained silicon. As it announced last September, IBM removes the SiGe layer before fabrication, after applying the strained silicon onto the insulator. The upshot: it gains benefits of strained silicon using what is essentially its standard SOI process. By removing the SiGe layer, it doesn't have to integrate that material into the chip fabrication process per se. It calls the new technique, Strained Silicon Directly on Insulator (SSDOI)."
02/04/04 Intel 90nm Performance on Par with AMD .13-micron - Electronic News
"Intel's 90 nm Prescott does not increase performance appreciably over AMD Athlon XP, the company's 32-bit processor at .13-micron. That could mean AMD will pull ahead in terms of performance once it transitions to 90nm."
01/18/04 AMD on 90 nano target – so is Intel - the inquirer
"This should come as no surprise to anyone following the upcoming move, there has only been good news from AMD so far. It demoed working 90nm Opterons at Comdex almost two months ago, and still has six months to go. I expect good things here."
12/15/03 AMD's 90nm Processors to Dissipate 105W? - X-bit labs
"Sources close to AMD’s partners said the company is going to employ some new power requirements for mainboards designed to support future AMD64 processors, such as AMD Athlon 64 4000+ and the Athlon 64 FX-55, both most probably to be made using 90nm technology.
12/10/03 AMD to deliver 90nm chip samples in 2Q 2004 - Digi Times
"US chipmaker Advanced Micro Devices (AMD) is scheduled to deliver chip samples using a 90nm manufacturing process on 8-inch wafers in the second quarter of next year, Christopher Bode, manager for AMD’s AMP (automated precision manufacturing) development, said in Taipei yesterday."
11/21/03 AMD admits 90nm production slippage - The Register
"AMD's roadmap calls for 90nm Opteron 100, 200 and 800-series processors to ship during H2 2004, codenamed 'Venus', 'Troy' and 'Athens', respectively. During the same timeframe, the chip maker will launch the 90nm Athlon 64 'Winchester' and the Athlon 64 FX 'San Diego'. "
11/20/03 IBM to add clock throttling tech to 90nm G5 chip - The Register
"According to the pre-conference programme, IBM will unveil PowerTune during an 18 February conference session. PowerTune is described as "a power-management technique for a multi-gigahertz superscalar [64-bit] PowerPC processor in a 90nm technology [offering] a dynamically controlled clock frequency with noise suppression as well as a synchronisation circuit for a multi-processor system".
11/14/03 Silicon on insulator key to AMD 90nm success – analyst - The Register
"It also means that, AMD is going to get a lot more CPUs off a single 200mm wafer than it can at 130nm. The current Opteron die runs to 193mm2, while the 90nm version is 114mm2, according to an AMD presentation seen by Whittington. So while a 200mm wafer yields around 131 130nm chips, it should yield 235 90nm parts. How many will be working is another matter, but Whittington estimates that the cost per chip to AMD is 30 per cent less at 90nm than 130nm, giving it much more room to play off price against margin, allowing it to drive revenue growth or play on price if Intel pushes it in that direction"
11/09/03 Opteron 90 nanometer chips to sample in weeks - the inquirer
"The 90 nanometer chips are designed for 45 watts maximum rather than the 80-90 watts they currently eat up. If the reports turn out to be correct, and our sources for this have proved themselves highly reliable in the past, it's set to cause Intel the mother of all migraines."
10/07/03 Transmeta Selects Fujitsu as the first foundry for its 90nm generation of Efficeon Transmeta announced that it has selected Fujitsu as the first foundry for its 90nm (90 nanometer = 0.09-micron) generation of Efficeon processors. Engineering teams from the two companies have been working closely together to port the Efficeon design to Fujitsu's CS100 90nm CMOS process, which features transistors with an industry leading 40nm physical gate length. Volume production for the 90nm version of Efficeon is slated for the second-half of 2004.
09/22/03 Intel development of 90nm technology moving smoothly - Digi Times
"The company has attained yields suitable for volume production of 90nm-based processors at Fab D1C, according to Burns. Incorporating CDO (carbon-doped oxide, a low-k dielectric material) technology, seven copper interconnect layers and flip chip packaging, the processors’ performance was outstanding, he added. Fabs 11X is slated to begin volume production next quarter and Fab 24 will start wafer input in 2004."
08/29/03 Intel puts desktop, mobile MPUs on 90-nm fast track - Silicon Strategies
"An Intel spokesman said the 90nm process ramp is proceeding as anticipated. Initial production at the company's D1C 300mm-wafer development fab in Hillsboro, Ore., is already yielding validated processors, he said. Fab 11X in Albuquerque, N.M., is primed to come on line in the fourth quarter as planned, while a plant in Leixlip, Ireland, is expected to start 90nm processing in the first half of 2004"
08/12/03 Heat problem with Intel 90nm process CPU - PC Watch
08/09/03 The release of Intel and Dothan 1 quarter postponement - PC Watch
07/10/03 Semiconductor shrink to 90 nanometers a giant leap for chipkind - the inquirer
"Essentially, moving from .13µ (microns) to .09µ microns, or 90 nanometers, requires a level of chip engineering that's far greater from the earlier shift from .18µ. When TSMC attempted that move, it discovered that it wasn't able to easily shift to the smaller process then, causing difficulties for a number of customers, notably Transmeta, Via and Nvidia."
01/29/03 90-nm chips being delayed, experts say - EE Times
"Moreover, there are a number of new problems cropping up at the 90-nm node that designers must learn to deal with, such as how to ensure that the chip is designed to produce acceptable yields. "Just as 130-nanometer was the harbinger to signal-integrity issues, 90-nanometer is the harbinger for design for manufacturability," said Ted Vucurevich, chief technology officer at Cadence Design Systems"
12/31/02 EDA vendors brace for 90-nm challenge in 2003 - EE Design
"Ninety-nm chips will start moving off the production lines in 2003, vendors say, and supporting tools will be available too. "For the coming year, the focus is on getting 90-nm production ready, and for 60 nm, it's development," said Wally Rhines, chief executive officer of Mentor Graphics Corp. and president of the EDA Consortium."
09/20/02 TSMC delays 90nm trial production to June 2003 - Digi Times
"Taiwan Semiconductor Manufacturing Company (TSMC) will delay the launch of 90-nanometer (nm) trial production by half a year to June 2003, confirmed R&D senior vice president Chiang Shang-yi on September 19"
09/13/02 CPU Breakthrough: Chips Enter the Nano-Age - Extreme Tech
"Intel's current 0.13 micron manufacturing process is split between using 200mm wafers and 300mm wafers. The company's upcoming 90nm process will use 300mm wafers exclusively. Transistor gate lengths at 0.13 micron are less than 70nm, while the new process technology will have gate lengths of less than 50nm"
08/27/02 Failures plague 130-nanometer IC processes - EE Times
"Yield and reliability issues threaten the touted dual-damascene copper interconnect structures of leading 130-nanometer processes, having caused both poor yields at wafer sort and unacceptable failure rates over the life of apparently good chips, according to a wide range of industry sources"
08/16/02 Industry reacts to Intel's strained silicon move - EE Times
"Intel's move at the 90-nm node sets up a head-to-head competition in the X86 processor arena between the Intel strained-silicon technique and the silicon-on-insulator approach taken by Advanced Micro Devices for the company's Hammer line"
08/16/02 EDA vendors ponder 90-nm tools - EE Design
07/29/02 Despite Spending Slowdown, Intel 90nm Process Still on Track - Electronic News
"The enormous 300mm capacity of Fab D1C, Fab11X, and Fab 24 should allow Intel to retire the venerable Fabs 11 and 12 from processor production, using them for flash memory or previous-generation products. The high cost of building new fabs and the additional efficiencies of 300mm will entice Intel to upgrade at least one 200mm fab to 300mm for the P1262 process"
06/05/02 Intel exec predicts leading edge 'capacity famine' - EE Times
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