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Visit AMD Dresden Fab 30
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AMD Facilities
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The result of a uniquely structured international joint venture known as Fujitsu AMD Semiconductor Limited (Spansion), the current facilities in Aizu-Wakamatsu are dedicated to volume production of Flash memory devices, and combined are capable of processing more than 20,000 eight-inch wafers per week utilizing the most advanced processes.

The first Spansion facility (JV1) commenced volume production of 4- and 16-megabit Flash memory chips on 0.5-micron technology in the fourth quarter of 1994. Since then, the facility has migrated to 0.32 and 0.23-micron technology. The JV1 facility includes 65,950 square feet of Class 1 clean room space housed in a 276,000 square-foot building.

Groundbreaking for the second joint-venture facility (JV2) occurred in March of 1996, and first shipments began in the fourth quarter of 1997. The 300,300 square-foot facility includes approximately 89,700 square feet of Class 1 clean room space, and uses an advanced 0.23-micron process technology.

In July of 2000, Spansion broke ground for its third Flash memory fab in Aizu-Wakamatsu. FASL Fab JV3 is now producing advanced Flash memory devices on 0.17 micron technology. This $1.5 billion facility encompasses 110,000 square feet of clean room space. JV3 encompasses 459,000 total square feet, including a shell for future expansion that can accommodate
12 inch (300mm) wafer production.

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Spansion and Atheros Communications Team to Deliver Innovative Packaging Solution for Handset Manufacturers

Leading Flash Memory and Wireless LAN Providers Develop Package-on-Package to Enable Small Dual-Mode Mobile Phones

Spansion LLC, the Flash memory venture of AMD (NYSE:AMD) and Fujitsu Limited (TSE:6702), and Atheros Communications, Inc. (NASDAQ: ATHR), a leading developer of advanced wireless solutions, today announced they have developed an innovative packaging solution that is designed to significantly reduce the size of today’s dual-mode Cellular/Wireless LAN (WLAN) mobile phones. The packaging solution vertically stacks the Atheros Radio-on-Chip for Mobile (ROCm™) 802.11a/g and 802.11g solutions with Spansion MirrorBit Flash memory. This solution enables handset manufacturers to provide valuable new services, such as Voice-over-IP (VoIP) and WLAN data connectivity for fast download of content such as ring tones, music, video clips, games, and email, in very small form factors.

An innovative approach to semiconductor packaging, Package-on-Package (PoP) solutions vertically stack system components for board savings, lower pin-count, simplified system integration and enhanced performance. The resulting PoP enables handset suppliers increased flexibility as compared to alternative packaging solutions like System-in-Package (SIP). The new PoP solutions based on the Atheros and Spansion devices will combine WLAN radio and baseband functions with the high-density code and data storage required by the vast majority of handset end-products--in a small footprint measuring only 160 mm2. In comparison, a similarly configured solution using discrete chips can be as large as 800 mm2. 

“Connectivity and content will drive adoption of next-generation cell phones,” said Amir Mashkoori, senior vice president and general manager of
Spansion’s Wireless Solutions Division. “As handset manufacturers require more memory to enable new features and Wi-Fi to deliver the bandwidth necessary for consumers to access and download rich content and applications on their phones, Atheros and Spansion have each contributed to the ideal solution.  Together, we expect both companies will play a key role in enabling cellular, Wi-Fi convergence.”

Spansion offers a 12 x 12 mm package that integrates up to five different memory chips in a 128-ball solution with a 0.65 mm pitch.  This package rests on top of an Atheros package, also measuring 12 x 12 mm, which provides the ROCm 802.11a/g and 802.11g (AR6001 family) Mobile WLAN chips in a 376-ball package with a 0.5 mm pitch.

“Our drive towards low power, low cost and small footprints is enabling high-performance WLAN technology in more handheld devices such as dual-mode phones,” said Craig Barratt, president and chief executive officer of Atheros. “We are pleased to be working with Spansion, leveraging their technical expertise in developing advanced packaging solutions and success in mobile phone and handheld markets. Together we’ll offer an innovative solution for integrating WLAN capabilities into new, smaller mobile phones with better performance and cost savings.”      

Atheros ROCm™ Platform

The Atheros ROCm solutions minimize power consumption through the use of techniques such as automatic power save delivery (APSD) and an extremely low-power sleep mode. ROCm also processes beacons, multi-cast and broadcast packets without waking up the host system processor, thus further reducing the power consumption and improving the battery life.


The memory and logic packages are expected to be available in the fourth quarter from
Spansion and Atheros, respectively, for assembly into a total PoP solution. For more details about the solution, please contact  or

About Atheros Communications, Inc.

Atheros Communications is a leading developer of semiconductor system solutions for wireless communications products. Atheros combines its wireless systems expertise with high-performance radio frequency (RF), mixed signal and digital semiconductor design skills to provide highly integrated chipsets that are manufacturable on low-cost, standard complementary metal-oxide semiconductor (CMOS) processes. Atheros technology is being used by a broad base of leading customers, including personal computer, networking equipment and handset manufacturers.

About Spansion

Spansion, the Flash memory venture of AMD and Fujitsu, is the largest company in the world dedicated exclusively to developing, designing, and manufacturing Flash memory products. In fiscal 2004, Spansion's total net sales were approximately $2.3 billion. The company offers the broadest NOR Flash memory portfolio in the industry, for use in the wireless, automotive, networking, telecommunications and consumer electronics markets. The company's portfolio is supported by a worldwide network of advanced manufacturing facilities, system-level expertise and dedicated design support, and an unwavering commitment to our customers' success.

Spansion, the Spansion logo, MirrorBit, ORNAND and combinations thereof, are trademarks of Spansion LLC. AMD is a trademark of Advanced Micro Devices, Inc. Other names used are for informational purposes only and may be trademarks of their respective owners.