|AMD-Fujitsu Spansion (ex-FASL) News - 10/12/04|
|Red for new items|
|Your best source for AMD Athlon 64, barebones, DDR, Duron, Motherboards, nForce2, nForce3, nForce4, notebooks, Opteron & Sempron information|
11/06/03 Analyst Day
AMD Saxony & Virtual Tour
|The result of a uniquely structured international joint venture known as Fujitsu AMD Semiconductor Limited (Spansion), the current facilities in Aizu-Wakamatsu are dedicated to volume production of Flash memory devices, and combined are capable of processing more than 20,000 eight-inch wafers per week utilizing the most advanced processes.
The first Spansion facility (JV1) commenced volume production of 4- and 16-megabit Flash memory chips on 0.5-micron technology in the fourth quarter of 1994. Since then, the facility has migrated to 0.32 and 0.23-micron technology. The JV1 facility includes 65,950 square feet of Class 1 clean room space housed in a 276,000 square-foot building.
Groundbreaking for the second joint-venture facility (JV2) occurred in March of 1996, and first shipments began in the fourth quarter of 1997. The 300,300 square-foot facility includes approximately 89,700 square feet of Class 1 clean room space, and uses an advanced 0.23-micron process technology.
In July of 2000, Spansion broke ground for its third Flash memory fab in Aizu-Wakamatsu. FASL Fab JV3 is now producing advanced Flash memory devices on 0.17 micron technology. This $1.5 billion facility encompasses 110,000 square feet of clean room space. JV3 encompasses 459,000 total square feet, including a shell for future expansion that can accommodate 12 inch (300mm) wafer production.
Jerry Sanders Special
Hector de Ruiz Special
Board of Directors
AMD Execs Interviews
300mm wafer Special
Athlon 64 Special
AMD Geode Special
AMD & Cray Special
Moore's Law Special
|Spansion’s Fab 25 Now Dedicated to 110nm Floating Gate Flash Memory Products
Fastest node transition yet made possible by AMD’s Automated Precision Manufacturing technology
SUNNYVALE, CA - October 12, 2004 - Spansion LLC, the Flash memory subsidiary of Advanced Micro Devices, Inc. (NYSE: AMD) and Fujitsu Limited (TSE: 6702), today announced that Fab 25, the company’s flagship manufacturing plant in Austin, is now fully dedicated to producing 110-nanometer floating gate Flash memory products for wireless and other markets.
This accomplishment represents the fastest node transition in Spansion’s history from development to world-class yields. It’s an especially significant milestone achieved only two years after Fab 25’s manufacturing process was fully converted from logic to memory.
A key success factor for this rapid technology transition is AMD’s Automated Precision Manufacturing (APM) technology, a patented suite of more than 300 leading-edge fab automation, optimization and real-time data analysis technologies used to reduce time-to-yield on new technologies and decrease manufacturing costs. APM was first developed and implemented in Fab 25 and expanded later in AMD’s world-class factories in Dresden, Germany, Fab 30 and the upcoming 300mm Fab 36.
“Fab 25 continues to be a model for the Flash memory industry in terms of product yield and use of leading-edge manufacturing technology,” said Jim Doran, executive vice president of worldwide technology development and manufacturing for Spansion. “We consistently set and break industry records at Fab 25 thanks to APM. Our transition to 110-nanometer was completed in just a few months, with minimal impact on our production output and yields far better than we had anticipated.”
Using APM helps AMD and Spansion to rapidly introduce product enhancements in their manufacturing plants while the production line is running. Increased accuracy and control helps to ensure both companies can consistently achieve higher yields faster on next-generation technologies, and more closely aligns fab output with customers’ shifting supply chain requirements.
“APM is essentially a massive factory control software suite that is one of the cornerstones of AMD’s ability to compete,” said Dan Hutcheson, president of VLSI Research. “It does this not only by enabling greater efficiency, it also enables higher baseline yields, better binning, and faster yield learning, all of which drives product performance. The forethought and hard work put into APM has paid off. Today few chipmakers can come close to AMD’s level of fab automation, precision and integration.”
About Spansion LLC
Spansion™ Flash memory products encompass a broad spectrum of densities and features to support a wide range of markets. Spansion Flash memory customers represent leaders in the wireless, cellular, automotive, networking, telecommunications and consumer electronics markets. There are a variety of Spansion Flash memory products, such as devices based on the innovative MirrorBit™ technology; the award-winning simultaneous read-write (SRW) product family; super low-voltage 1.8-volt Flash memory devices; and burst- and page-mode devices. Information about Spansion Flash memory solutions is available at http://www.spansion.com/overview.
Spansion was formed by the integration of AMD's and Fujitsu's Flash memory operations in 2003. It is the largest NOR Flash memory company in the world. Spansion Flash memory solutions are available worldwide from AMD (NYSE:AMD) and Fujitsu (TSE:6702).
Spansion, the Spansion logo, MirrorBit, and combinations thereof are trademarks of Spansion LLC. Other names are for informational purposes only and may be trademarks of their respective owners.