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Earlier news here ______________________________________________ 10/05/05 - Firmware Solution for AMD Geode GX Ref Board General Software, Inc today announced support of Embedded BIOS® 2000 for the AMD Geode GX Single Board Computer Reference Design Kit (AMD Geode GX SBC RDK). AMD's near manufacture-ready reference design kit is a compact, low-power, high-performance system designed to help facilitate the next generation of single board computer and network appliances. Target application markets include single board computer, point-of-sale, corporate thin client, network appliances and kiosks. Read more here ______________________________________________ 10/04/05 - Hoff and Associates Will Offer Cray XD1 Cray Inc. today announced that engineering solutions consultancy Hoff and Associates will offer Cray XD1 supercomputers to its computer-aided engineering (CAE) clients as part of the company's comprehensive solutions portfolio. The Cray XD1 architecture is designed to accelerate engineering and other high-performance computing (HPC) applications that require peak performance to quickly solve complex problems. Read more here ______________________________________________ 09/26/05 - SUN's Supplier of the Year Award for AMD Advanced Micro Devices (AMD) received this year's Supplier of the Year Award for its extraordinary contributions to Sun's stellar record of delivering top quality technology and service to its customers. With the introduction of Sun's new industry-standard enterprise Sun Fire(TM) x64 (x86, 64-bit) server family on September 12, 2005, AMD becomes an even more important partner and supplier to Sun. Read the rest here ______________________________________________ 09/21/09 - Spansion High-Density Flash Memory Solution Spansion today showed silicon of its single-chip 1 Gbit (Gb) GL NOR Flash memory and demonstrated working silicon of its 1Gb Ornand Flash memory based on 90nm MirrorBit technology. Manufactured at Spansion's flagship Fab 25 facility in Austin, Texas, Spansion 90nm MirrorBit technology is the foundation for a compelling high-density Flash memory roadmap, featuring products combining the density, performance, reliability and cost structure required for wireless and embedded applications. Read more here ______________________________________________ 09/21/05 - 64-bit Sempron Price Hike After providing a temporary price reduction to help customers move from Socket A to the 754 Pin platform, AMD is now raising Socket 754 64-bit Sempron prices from 6 to 13% depending on model number. The parts affected are AMD 64-bit Sempron 2600+, 2800+, 3000+ and 3100+ ______________________________________________ 09/20/05 - New at AMDboard.com! - A8N32-SLI Deluxe nForce4 SLI X16 board specifications - Biostar iDEQ 330N nForce410 barebone added - Albatron K8NF4X nForce4 4X motherboard added - Albatron KM51PV nForce410 motherboard added ______________________________________________ 09/19/05 - Spansion and Atheros team up Spansion and Atheros today announced they have developed an innovative packaging solution designed to significantly reduce the size of today’s dual-mode Cellular/Wireless LAN (WLAN) mobile phones. The packaging solution vertically stacks the Atheros Radio-on-Chip for Mobile (ROCm) 802.11a/g and 802.11g solutions with Spansion MirrorBit Flash memory. This solution enables handset manufacturers to provide valuable new services, such as Voice-over-IP (VoIP) and WLAN data connectivity for fast download of content such as ring tones, music, video clips, games, and email, in very small form factors. More here ______________________________________________ 09/16/05 - New at AMDboard.com! - NVIDIA nForce 400 page created with nForce 410 & 430 - BiostarTForce 6100-939 GeForce 6100 board added - Foxconn WinFast 6100K8MA GeForce 6100 board added - Foxconn WinFast 6150K8MA-8KERS GeForce 6150 added - New top menu added - See for example here ______________________________________________ 09/15/05 - Spansion Introduces Innovative PoP Solution Spansion LLC announced it is shipping Package-on-Package (PoP) Flash memory samples to customers that will enable them to deliver sleek, feature-rich wireless phones, PDAs, digital cameras and MP3 players. Spansion's new PoP solution vertically combines discrete logic and memory packages for board space savings, lower pin-count, simplified system integration and enhanced performance. We have more for you here ______________________________________________ 09/14/05 - Industry Leaders Join Forces on ASF 2.0 Leading technology companies, including Altiris, AMD, Broadcom, Computer Associates (CA), Dell and HP, today announced that they have joined forces to mutually support the Alert Standards Forum (ASF) 2.0 spec. The supporting companies are helping to deliver an ASF ecosystem that includes market education , interoperability testing and ASF certification , and the implementation of ASF features within various hardware and software products. Read more here ______________________________________________ 09/14/05 - Low-power AMD chip to be AMD64 compatible AMD announced that its AMD64 Longevity program for high-end embedded solutions, which guarantees processor availability for at least 5 years, has expanded to include two additional low-power AMD64 processors based on AMD's successful mobile products. These products have been requested by high-end embedded customers whose product plans demand low power, 32- and 64-bit high performance capability , small footprint and low pin count. Read here ______________________________________________ 09/13/05 - Sun agressive advertising targets Dell With the release of the new SunFire range, Sun is heavily advertising its new motto: "cheaper, faster, cooller than anything Dell has to offer". Many of the company ads were too agressive and were rejected by most of the publishers. We have found the links to them and they are all at the following address: Rejected here, Approved here and an extra plane flying over Dell headquarters here & here. Enjoy ;) ______________________________________________ 09/13/05 - BenQ to cooperate with AMD on notebook Willing to increase Joybook production, BenQ announces its intention to cooperate with AMD, DigiTimes reports today: "BenQ’s aim is to push its shipments of Joybook notebooks to 220,000-240,000 units in 2005, to 500,000 units in 2006, and to one million units in 2007, the sources noted. BenQ shipped about 100,000 Joybooks in 2004.". More here ______________________________________________ 09/12/05 - Debug Solution for AMD Turion and Sempron American Arium, an industry leader in hardware-assisted development tools, today announced debug support for AMD's Turion 64 mobile technology and Sempron, AMD's new value-priced processor. Arium's hardware-assisted debug solution comes in the form of the company's ECM-50 emulator and latest SourcePoint™ flagship debug interface. Read the whole press release here ______________________________________________ Older news here - Comments, suggestions, links here |
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